- Thermal compounds level surface irregularities that may be caused by production processes thereby improving heat transfer e.g. between a processor and a heat sink ,- High thermal conductivity ,- Low thermal resistance ,- No electrical conductivity ,- No static charge ,- Non-curing ,- Does not dry up ,- Non-evaporating and non-exuding ,- Convenient packaging: in a syringe ,- Contents: 4g (sufficient for about 20 applications) ,- Viscosity: 850 poise ,- Density: 3.96 g/cm³ - Content: 4 g ,- Density: 3.96 g/cm³ ,- Temperature Range: 50°C to 170°C ,- Viscosity: 850 P 2 years legal warranty only
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